|Current Rating:||1A for Pin|
|Dielectric Withstanding Voltage:||AC100V R.M.S.|
|Insulation Resistance:||100MΩ Min at DC500V|
|Contact Resistance(Low Level):||40MΩ Max.|
|Housing:||Thermoplastics,UL 94V-0 Rated|
|Outer Shell:||Stainless Stell.|
|Inner Shell:||Stainless Stell.|
|Mid Shield Plate:||Stainless Stell.|
|EMC PAD:||Stainless Stell.|
This type can solder as a wire as well as dip type
Micro usb now are mainly adopted by mobile,charging devices ,I/O port. Small size are more
popular,save space for consumer product and wins market share.
Housing: High Temperature Thermoplastic, Black Color, UL94V-0
Contact: Copper Alloy with 30u" Gold plating
Shell: Copper Alloy
Low Level Contact Resistance: 50mΩ max.
Insulation Resistance: 100MΩ min.
Voltage Rating: 30Vrms max.
Current Rating: 1A per contact
Dielectric Withstand Voltage: 100 VAC
Operating Temperature: -25~85°C
Insertion Force: 35N max.
Unmating Force: 7N min.
Durability: 5,000 insertion/ extraction cycles
Product Specification: GS-12-174
Packaging Specification: GS-14-873
TARGET MARKET / APPLICATION
Computers, laptops, servers
Printers, external drive units, monitors
Digital cameras, TV's, set-top box
Modems, keyboards, instrumentation
External Storage Systems
Features and Benefits
Metal shielding on all sides
Superior shielding against RFI and EMI
Ground mating halves
Beveled metal pins
Provides ground to PCB and strong board retention
Securing mating retention
5,000 mating cycles
The connector is used in portable devices for data transmission, media and charging applications.
Mini USB 2.0 connectors are ideal for applications in consumer, industrial and automotive markets.